Embedded Newsletter

CONTENTS
  • Chips & Component News
  • Tools & Software News
  • Boards & Modules News
  • Know-how (White Papers, Webinars and more)
  • February 3, 2010 – presented by
    ICC Media

    Sponsor Message 
    More than 100 I/O Modules Available for your Application

    TEWS Technologies’ family of PMC and IndustryPack carrier modules make a versatile range of 120 I/O mezzanines available for your application. The reuse for new system designs keeps your costs down. The TEWS carrier products support AdvancedTCA, CompactPCI, MicroTCA, Industrial PC, and VMEbus systems.

    CHIPS & COMPONENTS NEWS
  • Sharp:industrial 7-inch displays with LED backlight
  • Maxim: two-string HB LED driver for automotive applications
  • NEC: twelve 16-bit MCUs with USB 2.0 functionality
  • Renesas: MCUs with on-chip flash and compact package
  • Evatronix and CMP collaborate on educational program
  • Atlantik and Vincotech sign distribution agreement
  • Gleichmann offers "stretched panels" from Tovis
  • Rutronik presents temperature sensor IC family from ZMDI
  • Yamaichi: zero-insertion-force high speed connector
  • Toshiba: LED driver integrates brightness control
  • TOOLS & SOFTWARE NEWS
  • HCC: file system and USB products for TI Stellaris MCUs
  • Hitex: unit test tool allows temporal component testing
  • Cypress and Keil: compiler options for PSoC Creator IDE

    Sponsor Message 
    Memory is the heartbeat of every Embedded Design

    Agilent Technologies as an active member of JEDEC, offers an impressive portfolio of award winning DDR integrated test instruments! The powerful DDR memory solutions provide rapid insight into the essential tasks of validating, probing, separating and analyzing read/write bursts or debugging protocol violations and ensuring compliance.

  •  CoFluent: graphical specification and validation solution for Questa
  • CMX: support for Atollic TrueSTUDIO IDE
  • BOARDS & MODULES NEWS
  • AAEON: low power Embedded Controller for transportation market
  • ADLINK: COM Express module with Core i7/i5
  • EVOC: COM-Express and PC/104 boards

    Sponsor Message 
    oQtopus: DAVE's CPU module dedicated to connectivity applications

    DAVE presents its CPU Module based on the Freescale i.MX31C cpu. Like an octopus:

    • Reaches everywhere: wide interfaces set, perfect for connectivity
    • Is quick and clever: 400 Mhz ARM11 CPU, low power consumption
    • Adapts to all conditions: on-board FPGA for great flexibility, industrial specs compliant

  • Concurrent: AMC processor module with extended temperature option
  • Axiomtek: 22-inch medical-grade fanless touch panel computer
  • Nexcom: Embedded CPU boards for vertical markets
  • Hybricon: standard VITA 65 compliant VPX backplanes
  • TQ: medical devices certified to DIN EN ISO 13485
  • Lanner: network appliance with 7 Ethernet ports
  • Kontron integrates Core i7 across multiple embedded platforms  
  • Avalue: smart energy-saving digital signage computer
  • Interphase: wireless base station AdvancedMC
  • DSM: flat NanoServer with full HD
  • KNOW-HOW (White Papers, Webinars & more)
  • Enabling interoperability in high-performance embedded applications
  • Early verification and validation using model-based design
  • Risk management for counterfeit materials
  • Overview about the 6U VPX single board computer VPX6-185
  • Smarter products - software becomes the most active ingredient
  • Embedded Computing Yearbook 2009
  • Chips & Tools Yearbook 2009


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