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Embedded Newsletter

CONTENTS
  • Chips & Component News
  • Tools & Software News
  • Boards & Modules News
  • Know-how (White Papers, Webinars & more)
  • Video News
  • July 28, 2010 – presented by
    ICC Media



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    Sponsor Message 
    phyCARDs – Scalability within product series
    Product designs that are based on phyCARDs, can be realized with different controller architectures. The carrier board does not have to be modified to achieve this. Hence, such products can be flexibly adapted to the demands of the market. Entire product series can be optimized with phyCARDs regarding to performance and price.

    CHIPS & COMPONENTS NEWS
  • ADI: 20V dc-to-dc non-synchronous switching regulators
  • Infineon: 30V MOSFETs with 180A current capacity
  • ROHM: 0.9V drive MOSFETs

    Sponsor Message 
    COM Express Module with Intel Core i5 and i7 Processors
    Based on the COM Express form factor (95 x 125 mm), BRESSNER has launched a new line of single-board computers from Emerson Network Power with Intel Core i5 and i7 processors. The COMX CORE modules can be equipped with up to 8 GB of DDR3 memory. Featuring one PCIe x16 and seven PCIe x1 slots as well as one GigE interface, eight USB 2.0 ports and two independent graphics channels, these modules leave practically nothing to be desired in terms of interfaces.

  • Maxim: 16-bit RISC MCU with integrated infrared transceiver
  • Mouser opens new European office in Milan
  • 4D Systems launches 1.44 inch LCD TFT modules
  • Digi-Key launches iPhone app for Europe
  • Silabs: wireless remote control on a chip
  • LTC: IMVP-6/6+/6.5 single-phase DC/DC controller
  • Actel: RTAX-DSP FPGAs achieve MIL-STD-883 Class B specification
  • TOOLS & SOFTWARE NEWS
  • NAG: more numerical functions for C & C++ developers
  • NI: Windows support and Camera Link connectivity for Embedded Vision Systems
  • Microchip: low-cost solution for designing with PIC24H MCUs and dsPIC33F DSCs
  • Quadros: GUI toolkit in C++ for Embedded devices
  • Raima: new version of their embedded database product RDM Embedded
  • Wind River: framework for automated software testing for Android
  • QNX: Neutrino RTOS Safe Kernel has been certified to IEC 61508 SIL 3
  • BOARDS & MODULES NEWS
  • VIA: modular expansion board and chassis development kits  
  • EKF: CompactPCI to PCI adapter
  • ADLINK: 6U CompactPCI processor blade with Core i7

    Sponsor Message 
    PROFIVE F12 Panel Board scalable Solutions through Intel Embedded Flexible Design
    The PROFIVE F12 single board computer has a versatile spectrum of applications and an outstanding price-performance ratio by utilizing the latest Intel Atom Dual Core technology. The entire panel-board is designed for fanless operation in applications such as industrial control, digital signage or other complex embedded applications.

  • Moxa: x86-based Industrial Embedded Marine computers
  • Swissbit: high reliability 1GB DDR2 VLP registered Mini-DIMM
  • GE: 6U OpenVPX board for military applications
  • AMP: low power embedded PC for rugged applications
  • Tews: extended temperature 3U compactPCI module
  • NI: new products connect LabVIEW to industrial networks
  • EVOC: Embedded EBX SBC supports dual-core i series
  • Data Modul: Mini-ITX industrial motherboard with AMD RS780E chipset
  • KNOW-HOW (White Papers, Webinars & more)
  • Safety: make software part of the solution
  • ARM-based industrial controllers – adaptable to customer specifications
  • Don’t crash at the finish line - how to overcome device complexity
  • Next-generation ColdFire MCUs feature FlexMemory and ultra-low power consumption 
  • Direct hardware access made easy with Secure & Unified Smart Interface
  • Agile methods and practices for embedded systems development
  • Embedded graphics and data models in the development of GUIs
  • VIDEO NEWS from European Embedded Market 
  • About embedded modules and manufacturing services - Interview with Stefan Brendjes, PHYTEC
  • Non-x86 embedded computing modules - Interview with Wolfgang Heinz-Fischer, TQ-Group
  • The innovative production line proof of concept
  • Fujitsu Microelectronics Europe becomes Fujitsu Semiconductor Europe
  • The iPhone has changed the paradigm – Interview with Asif Hazarika, IP Infusion
  • Mega Trends in Defence & Aerospace – Interview with Alex Wilson, Wind River
  • Embedded Computing trends – Interview with Dr. Stefan Rupp, Kontron
  • Challenges for a tool manufacturer in the automotive market - Interview with Heiko Rießland, PLS
  • Why is static analysis a challenge? – Interview with Michael Friess, AdaCore
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